Foundry 3D Packaging Engineer
AMD · Austin
This role is closedClosed Oct 18, 2026. AMD is no longer listing it. Their other open roles are below.
WhereAustinAustin, Texas · Austin, Texas, United States
TeamEngineering
PayNot listed
ListedPosted ~Sep 18, 2026 (per AMD)
About the role
Develop advanced 3D chip packaging technology, including TSV and hybrid bonding, taking it from proof of concept to high-volume manufacturing. Runs experiments, improves yield and reliability, and works with foundry partners and AMD designers.
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